2007-10 | Acceleration effect of CuCN in Ag electroplating for ultralarge-scale interconnects | Cho, Sung Ki; Lee, Jong Kyun; Kim, Soo-Kil; Kim, Jae Jeong |
2016-09 | Electrochemical CO2 reduction to CO on dendritic Ag-Cu electrocatalysts prepared by electrodeposition | Choi, Jihui; Kim, Myung Jun; Ahn, Sang Hyun; Choi, Insoo; Jang, Jong Hyun; Ham, Yu Seok; Kim, Jae Jeong; Kim, Soo-Kil |
2010-12 | Electrochemical preparation of Pt-based ternary alloy catalyst for direct methanol fuel cell anode | Ahn, Sang Hyun; Kwon, Oh Joong; Kim, Soo-Kil; Choi, Insoo; Kim, Jae Jeong |
2012-07 | Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis | Ahn, Sang Hyun; Hwang, Seung Jun; Yoo, Sung Jong; Choi, Insoo; Kim, Hyoung-Juhn; Jang, Jong Hyun; Nam, Suk Woo; Lim, Tae-Hoon; Lim, Taeho; Kim, Soo-Kil; Kim, Jae Jeong |
2008 | Preparation of Pt-Ru-Co ternary catalyst on carbon paper for PEMFC with electrodeposition and galvanic displacement | Ahn, Sang Hyun; Kim, Soo-Kil; Kwon, Oh Joong; Hwang, Sun-Mi; Kim, Jae Jeong |
2019-10-15 | Proton-exchange membrane CO2 electrolyzer for CO production using Ag catalyst directly electrodeposited onto gas diffusion layer | Ham, Yu Seok; Park, Young Sang; Jo, Ara; Jang, Jong Hyun; Kim, Soo-Kil; Kim, Jae Jeong |
2008-05 | Silver direct electrodeposition on Ru thin films | Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2014-03-06 | Synthesis of an active and stable Pt-shell-Pd-core/C catalyst for the electro-oxidation of methanol | Choi, Insoo; Ahn, Sang Hyun; Kim, Myeong Ho; Kwon, Oh Joong; Kim, Jae Jeong |
2008-04-30 | The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation | Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong |
2009-01 | Thin film silver deposition by electroplating for ULSI interconnect applications | Seo, Joon-Mo; Cho, Sung Ki; Koo, Hyo-Chol; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2008-01 | Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid | Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong |