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Showing results 1 to 5 of 5

Issue DateTitleAuthor(s)
2000-06Application of electrostatic bonding to field emission display vacuum packagingLee, DJ; Lee, NY; Jung, SJ; Kim, KS; Lee, YH; Jang, J; Ju, BK
1997-12Experimental analysis on the anodic bonding with an evaporated glass layerChoi, WB; Ju, BK; Lee, YH; Jeong, JW; Haskard, MR; Lee, NY; Sung, MY; Oh, MH
1999-01Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin filmChoi, WB; Ju, BK; Lee, YH; Jeong, SJ; Lee, NY; Sung, MY; Oh, MH
1998-11Glass-to-glass electrostatic bonding for FED tubeless packaging applicationJu, BK; Choi, WB; Lee, YH; Jung, SJ; Lee, NY; Han, JI; Cho, KI; Oh, MH
1999-01Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon waferChoi, WB; Ju, BK; Lee, YH; Oh, MH; Lee, NY; Sung, MY
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