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Issue DateTitleAuthor(s)
2016-01AN ON-WAFER EMBEDDED PASSIVE DEVICE USING CHIP-IN-SUBSTRATE PACKAGING TECHNOLOGY (vol 57, pg 2060, 2015)Liang, Junge; Kim, Eun Seong; Wang, Cong; Youn, Je-Hyun; Park, Min Chul; Kim, Nam Young
1

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