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AN ON-WAFER EMBEDDED PASSIVE DEVICE USING CHIP-IN-SUBSTRATE PACKAGING TECHNOLOGY (vol 57, pg 2060, 2015)

Authors

Liang, Junge; Kim, Eun Seong; Wang, Cong; Youn, Je-Hyun; Park, Min Chul; Kim, Nam Young

Issue Date

2016-01

Publisher

WILEY-BLACKWELL

Citation

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.58, no.1, pp.249 - 249

ISSN

0895-2477

URI

https://pubs.kist.re.kr/handle/201004/124528

DOI

10.1002/mop.29540

Appears in Collections:

KIST Article > 2016

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