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Showing results 1 to 6 of 6

Issue DateTitleAuthor(s)
2023-05-12Development of imidazole-based latent curing agent via mechanochemical encapsulationJang, Han Gyeol; Lim, Deok Jae; Kim Hae Na; An So Hyun; Park, Jong Hyuk; Park, Min; Lee, Doh Chang; Kim, Jaewoo
2023-10-12Development of imidazole-based latent curing agent via mechanochemical encapsulationJang, Han Gyeol; Lim, Deok Jae; An So Hyun; Park, Jong Hyuk; Park, Min; Doh Chang Lee; Kim, Jaewoo
2024-04-26Enhancing Storage Stability and Mechanical Property of One-Component Epoxy via Dry Encapsulated and Isocyanate-Blocked ImidazoleJang, Han Gyeol; Lim, Deok Jae; An, So Hyun; Park, Jong Hyuk; Park, Min; Lee, Doh C.; Kim, Jaewoo
2024-11Exploring synthesis techniques for an imidazole-based one-component epoxy latent curing agent: Chemical capping and mechano-chemical capsulingJang, Han Gyeol; Lim, Deok Jae; An, So Hyun; Park, Jong Hyuk; Park, Min; Park, Jinwoo; Park, Hyungbum; Kim, Byeong-Su; Lee, Doh C.; Kim, Jaewoo
2024-09-30Pioneering Synthesis Techniques for an Imidazole-based One-component Epoxy Latent Curing Agent: Chemical Capping and Mechano-chemical CapsulingLim, Deok Jae; Jang, Han Gyeol; An, So Hyun; Park, Jong Hyuk; Park, Min; Lee, Doh C.; Kim, Jaewoo
2025-12Unveiling Force Transmission Pathways in Polymer Networks: Backbone vs Cross-Linker Probed by Spiropyran Molecular Force SensorJo, Jun Young; Kim, Jiwon; Kim, Jaehoo; Jang, Han Gyeol; Lim, Deok Jae; Koo, Chong Min; Lee, Doh C.; Kim, Jaewoo
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