Development of imidazole-based latent curing agent via mechanochemical encapsulation

Abstract

Epoxy is widely utilized in various applications such as electronic packaging adhesives, solder resist ink, powder coating, composite materials, due to its excellent properties. It’s composed of resin and curing agent, and can be classified into one or two part types by pre-mixing or not. One part epoxy is economically and environmentally friendly due to stable performance and reduced working time,. Unfortunately, its outstanding curing tendency can lead to low storage stability.

In this study, we developed a novel latent curing agent with remarkable storage stability and rapid curing reaction. Through mechanofusion by dry encapsulation, we synthesized end-capped imidazole-based curing agents, and evaluated the synthesis, morphology, curing behavior and storage stability using FT-IR, NMR, SEM, DSC and rotational viscometer. As the results are a peak temperature of 134 ℃ and 30 days of RT stability, confirmed to be improved overall storage stability and curing behaviors.