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Showing results 1 to 4 of 4

Issue DateTitleAuthor(s)
1996-07Anodic bonding technique under low-temperature and low-voltage using evaporated glassChoi, Woo-Beom; Ju, Byeong-Kwon; Jeong, Seong-jae; Lee, Nam-Yang; Koh, Ken-Ha; Haskard, M.R.; Sung, Man-Young; Oh, Myung-Hwan
2000-01Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stabilityDUCK, JUNG LEE; Ju, Byeong-Kwon; Lee, Yun-Hi; Jang, Jin; Oh, Myung-Hwan
1998-07Light emitting devices using only edge emission reflected by cone-shaped micro-tip reflectorsLee, Yun-Hi; Lee, Sang-Jo; Kim, Young-Sik; Ju, Byeong-Kwon; Oh, Myung-Hwan
1997-08New packaging method of field emission display using silicon-to-ITO coated glass bondingJeong, Jee-Won; Ju, Byeong-Kwon; Choi, Woo-Beom; Lee, Duck-Jung; Lee, Yun-Hi; Lee, Nam-Yang; Jung, Seong-Jae; Choi, Doo-Jin; Oh, Myung-Hwan
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