| 2003-01 | A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon | Park, Y.-K.; Kim, Y.-K.; Kim, H.; Lee, D.-J.; Kim, C.-J.; Ju, B.-K.; Park, J.-O. |
| 2004-09 | Design and fabrication of a Bio-Material Property Measurement system | Kwon, J.; Park, S.; Lee, M.G.; Kim, Y.-I.; Kim, B.; Park, J.-O.; Park, J.-H. |
| 2004-09 | Design and fabrication of a large-deformed smart sensorized polymer actuator | Ryu, J.; Park, J.; Yun, S.; Kim, B.; Park, J.-O. |
| 2001-12 | Fabrication method of 3D feed horn shape MEMS antenna array using MRPBI system and application for microbolometer | PARK, JONG YEON; Kim, Kun Tae; Moon, S.; Park, J.-O.; Oh, M.-H.; Pak, J.J. |
| 2003-06-06 | Innovation ultra thin packaging for RF-MEMS devices | Park, Y.-K.; Kim, Y.-K.; Kim, C.-J.; Ju, B.-K.; Park, J.-O. |
| 2002 | Multiple Magnification Images Based Micropositioning for 3D Micro Assembly | Lee, S.J.; Kim, K.; Kim, D.-H.; Park, J.-O.; Park, G.T. |
| 2002-04 | Thermal and load-deflection FE analysis of parylene diaphragms | Sim, W.; Kim, B.; Choi, B.; Park, J.-O. |
