Thermal and load-deflection FE analysis of parylene diaphragms

Authors
Sim, W.Kim, B.Choi, B.Park, J.-O.
Issue Date
2002-04
Publisher
IEEE
Citation
2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002, pp.210 - 213
Abstract
In this study, the finite-element method(FEM) is employed in order to analyze the mechanical behavior of parylene diaphragm. Thermal and load-deflection FE analyses of flat and corrugated parylene diaphragm are performed to find an effect of the residual stress on the stiffness of the diaphragm. The simulation results show that the mechanical sensitivity of diaphragm is greatly influenced by the residual stress caused by the thermal process(silicon wet etching). The measurement is consistent with simulation result that takes the effect of residual stress into account. Optimum shape of corrugated diaphragm that considers the corrugation depth and number is determined.
ISSN
0000-0000
URI
https://pubs.kist.re.kr/handle/201004/83298
Appears in Collections:
KIST Conference Paper > 2002
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE