Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
---|---|---|
2019-04-11 | Optimizing Filler Network Formation in Polymer Composites for Packaging Material with High Thermal Conductivity | Lee Jang Geon; Shin Haeun; Park Chan Hee; Kim Chae Bin; Goh Munju |
2019-04-11 | Recyclable and Malleable Polymer/Hexagonal Boron Nitride Composites for Efficient Heat Dissipation | Shin Haeun; Jong Kuk Lim; Kim Chae Bin; Goh Munju |
- | Recyclable Polymer Composites with High Thermal Conductivity | Shin Haeun; Kim Chae Bin; Jong Kuk Lim; Goh Munju |