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Optimizing Filler Network Formation in Polymer Composites for Packaging Material with High Thermal Conductivity

Other Titles

높은 열전도도를 갖는 패키징 재료용 고분자 복합재료의 필러 네트워크 형성 최적화

Authors

Lee Jang Geon; Shin Haeun; Park Chan Hee; Kim Chae Bin; Goh Munju

Issue Date

2019-04-11

Publisher

한국고분자학회

Citation

2019년 한국고분자학회 춘계학술대회

ISSN

-

URI

https://pubs.kist.re.kr/handle/201004/78929

Appears in Collections:

KIST Conference Paper > 2019

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