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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2015-09An on-wafer embedded passive device using chip-in-substrate packaging technologyLiang, Junge G.; Kim, Eun Seong; Wang, Cong; Youn, Je-Hyun; Park, Min Chul; Kim, Nam Young
2016-01AN ON-WAFER EMBEDDED PASSIVE DEVICE USING CHIP-IN-SUBSTRATE PACKAGING TECHNOLOGY (vol 57, pg 2060, 2015)Liang, Junge; Kim, Eun Seong; Wang, Cong; Youn, Je-Hyun; Park, Min Chul; Kim, Nam Young
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