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Electrical Characteristics of Atomic Layer Deposited Tungsten Nitride Diffusion Barrier for Cu Interconnects

Authors

Kim, Yong Tae; Lee Eui-Bok; Kim, Young-Hwan; KIM, CHUN KEUN; Byeong Kwon

Citation

2010 Asia-Pacific Workshop on fundamentals and Applications of Advanced Semiconductor Devices, v.110, no.110, pp.61 - 63

Keywords

ALD; Diffusion barrier; Cu interconnects; Electromigration

URI

https://pubs.kist.re.kr/handle/201004/100193

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