Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling

Authors
KARNG, SARNG WOOKyudae HwangJongmin MoonKim, Seo Young
Citation
InterPACK'09 Conference, no.89410, pp.1 - 6
Keywords
Mini liquid-cooled cold plate; thermal resistance; pin-finned copper; aluminum foam; overall heat transfer coefficient
URI
https://pubs.kist.re.kr/handle/201004/101295
Appears in Collections:
KIST Conference Paper > Others
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