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dc.contributor.authorHong Ju Hi-
dc.contributor.authorHAN, SEUNG HEE-
dc.contributor.authorLEE, YEON HEE-
dc.contributor.authorKang-Jin Kim-
dc.date.accessioned2024-01-13T08:02:55Z-
dc.date.available2024-01-13T08:02:55Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/104491-
dc.languageEnglish-
dc.subjectadhesion-
dc.subjectPSII-
dc.subjectCopper-
dc.subjectpolyimide-
dc.titleEnhancement of adhesion strength between Cu and PoIyimide by PSII treatment-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제 94회 대한화학회, v.94, pp.141-
dc.citation.title제 94회 대한화학회-
dc.citation.volume94-
dc.citation.startPage141-
dc.citation.endPage141-
dc.citation.conferencePlaceKO-
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