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dc.contributor.authorChang Woo Lee-
dc.contributor.authorKim, Yong Tae-
dc.contributor.authorPark Ji Ho-
dc.contributor.authorHee Joon Kim-
dc.date.accessioned2024-01-13T08:33:05Z-
dc.date.available2024-01-13T08:33:05Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/104765-
dc.languageEnglish-
dc.subjectW-C-N-
dc.subjectdiffusion barrier-
dc.titleCharacteristics of W-C-N thin film as a new diffusion barrier for Cu interconnection-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments-
dc.citation.title2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments-
dc.citation.conferencePlaceKO-
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