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dc.contributor.authorLEE, YEON HEE-
dc.contributor.authorHong Ju Hi-
dc.contributor.author천혜진-
dc.contributor.authorHAN, SEUNG HEE-
dc.date.accessioned2024-01-13T09:00:44Z-
dc.date.available2024-01-13T09:00:44Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/104869-
dc.languageEnglish-
dc.subjectadhesion-
dc.subjectcopper-
dc.subjectplasma-
dc.subjectdeposition-
dc.subjectEIAMAD-
dc.subjectpolymer-
dc.titleInvestigation of improved adhesion between Cu films and polyimide by PSII-EIAMAD technique-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationEuropean Confernece on Applications of Surface and Interface Analysis, pp.91-
dc.citation.titleEuropean Confernece on Applications of Surface and Interface Analysis-
dc.citation.startPage91-
dc.citation.endPage91-
dc.citation.conferencePlaceAU-
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