Investigation of improved adhesion between Cu films and polyimide by PSII-EIAMAD technique

Authors
LEE, YEON HEEHong Ju Hi천혜진HAN, SEUNG HEE
Citation
European Confernece on Applications of Surface and Interface Analysis, pp.91
Keywords
adhesion; copper; plasma; deposition; EIAMAD; polymer
URI
https://pubs.kist.re.kr/handle/201004/104869
Appears in Collections:
KIST Conference Paper > Others
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE