Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Heon Woong Choi | - |
dc.contributor.author | 문명운 | - |
dc.contributor.author | KIm Tae Young | - |
dc.contributor.author | Lee, Kwang Ryeol | - |
dc.contributor.author | Kyu Hwan Oh | - |
dc.date.accessioned | 2024-01-13T10:32:48Z | - |
dc.date.available | 2024-01-13T10:32:48Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.issn | 0272-9172 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/105804 | - |
dc.language | English | - |
dc.subject | DLC | - |
dc.subject | thermal anneling | - |
dc.subject | residual stress | - |
dc.title | The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | Materials Research Society Symposium Proceedings, v.795, pp.U11.42.1(87) - U11.42.6(92) | - |
dc.citation.title | Materials Research Society Symposium Proceedings | - |
dc.citation.volume | 795 | - |
dc.citation.startPage | U11.42.1(87) | - |
dc.citation.endPage | U11.42.6(92) | - |
dc.citation.conferencePlace | US | - |
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