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dc.contributor.authorJin Hyun-
dc.contributor.authorJEON BUP JU-
dc.contributor.authorDongjin Byun-
dc.contributor.authorLee, Joong Kee-
dc.date.accessioned2024-01-13T11:02:33Z-
dc.date.available2024-01-13T11:02:33Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/106055-
dc.languageEnglish-
dc.subjectCu film-
dc.subjectECR-MOCVD-
dc.subjectDC bias-
dc.subjectpolymer substrate-
dc.titleEffects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(PET) substrate prepared by ECRMOCVD coupled with a periodic DC bias-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMat. Res. Soc. Symp. Proc., v.795, pp.851 - 856-
dc.citation.titleMat. Res. Soc. Symp. Proc.-
dc.citation.volume795-
dc.citation.startPage851-
dc.citation.endPage856-
dc.citation.conferencePlaceUS-
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