KIST Library Institutional Repository

3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .

Authors

김용국; 박윤진; 김철주; Ju Byeong Kwon

Citation

제 10 회 반도체학술대회, pp.707 - 708

Keywords

RF MEMS; thin wafer; packaging

URI

https://pubs.kist.re.kr/handle/201004/106488

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML