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dc.contributor.author심현상-
dc.contributor.authorKim Yong Tae-
dc.contributor.author전형탁-
dc.date.accessioned2024-01-13T12:30:45Z-
dc.date.available2024-01-13T12:30:45Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/106737-
dc.languageEnglish-
dc.subject펄스플라즈마-
dc.subject원자층증착-
dc.subjectcu-interconnect-
dc.subjectdiffusion barrier기술-
dc.titleCharacteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationAVS Topical Conference on Atomic Layer Deposition, pp.67-
dc.citation.titleAVS Topical Conference on Atomic Layer Deposition-
dc.citation.startPage67-
dc.citation.endPage67-
dc.citation.conferencePlaceKO-
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