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dc.contributor.author박윤권-
dc.contributor.author이덕중-
dc.contributor.author박흥우-
dc.contributor.author송인상-
dc.contributor.author김정우-
dc.contributor.authorSONG CI MOO-
dc.contributor.authorLEE YUN HI-
dc.contributor.author김철주-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T13:01:07Z-
dc.date.available2024-01-13T13:01:07Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/107028-
dc.languageEnglish-
dc.subjectflip-chip-
dc.subjectwafer level package-
dc.subjectRF-MEMS-
dc.subjectbump-
dc.titleA novel wafer level packaging of the RF-MEMS devices with low loss-
dc.title.alternativeRF-MEMS 소자의 저 손실을 위한 새로운 웨이퍼 레벨 패키징-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation4 회 한국 MEMS 학술대회, pp.70 - 75-
dc.citation.title4 회 한국 MEMS 학술대회-
dc.citation.startPage70-
dc.citation.endPage75-
dc.citation.conferencePlaceKO-
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