Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박흥우 | - |
dc.contributor.author | 이덕중 | - |
dc.contributor.author | 박윤권 | - |
dc.contributor.author | 김철주 | - |
dc.contributor.author | PARK JEONG HO | - |
dc.contributor.author | 서용교 | - |
dc.contributor.author | 김정우 | - |
dc.contributor.author | SONG CI MOO | - |
dc.contributor.author | OH MYUNG HWAN | - |
dc.contributor.author | Ju Byeong Kwon | - |
dc.date.accessioned | 2024-01-13T14:03:47Z | - |
dc.date.available | 2024-01-13T14:03:47Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/107737 | - |
dc.language | English | - |
dc.subject | flip-chip | - |
dc.title | Packaging of the RF-MEMS switch | - |
dc.title.alternative | RF MEMS 스위치의 패키징 | - |
dc.type | Conference | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | 제 3 회 MEMS 학술대회, pp.71 - 76. | - |
dc.citation.title | 제 3 회 MEMS 학술대회 | - |
dc.citation.startPage | 71 | - |
dc.citation.endPage | 76. | - |
dc.citation.conferencePlace | KO | - |
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