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dc.contributor.authorYun-Kwon Park-
dc.contributor.authorHeung-Woo Park-
dc.contributor.authorDuck-Jung Lee-
dc.contributor.authorJung-Ho Park-
dc.contributor.authorChung-Woo Kim-
dc.contributor.authorCi-Moo Song-
dc.contributor.authorChul-Ju Kim-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T14:34:04Z-
dc.date.available2024-01-13T14:34:04Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/108015-
dc.languageEnglish-
dc.subjectRF-MEMS-
dc.titleRF-MEMS package with vertical via hole for low loss characteristic-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationProceedings of the International Sensor Conference 2001, pp.247 - 248.-
dc.citation.titleProceedings of the International Sensor Conference 2001-
dc.citation.startPage247-
dc.citation.endPage248.-
dc.citation.conferencePlaceKO-
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