Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yun-Kwon Park | - |
dc.contributor.author | Heung-Woo Park | - |
dc.contributor.author | Duck-Jung Lee | - |
dc.contributor.author | Jung-Ho Park | - |
dc.contributor.author | Chung-Woo Kim | - |
dc.contributor.author | Ci-Moo Song | - |
dc.contributor.author | Chul-Ju Kim | - |
dc.contributor.author | Ju Byeong Kwon | - |
dc.date.accessioned | 2024-01-13T14:34:04Z | - |
dc.date.available | 2024-01-13T14:34:04Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108015 | - |
dc.language | English | - |
dc.subject | RF-MEMS | - |
dc.title | RF-MEMS package with vertical via hole for low loss characteristic | - |
dc.type | Conference | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | Proceedings of the International Sensor Conference 2001, pp.247 - 248. | - |
dc.citation.title | Proceedings of the International Sensor Conference 2001 | - |
dc.citation.startPage | 247 | - |
dc.citation.endPage | 248. | - |
dc.citation.conferencePlace | KO | - |
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