Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백진욱 | - |
| dc.contributor.author | Kim Seo Young | - |
| dc.contributor.author | 강병하 | - |
| dc.date.accessioned | 2024-01-13T16:04:23Z | - |
| dc.date.available | 2024-01-13T16:04:23Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108828 | - |
| dc.language | English | - |
| dc.subject | aluminum foam | - |
| dc.title | Heat transfer from an aluminum foam heat sink for electronics cooling | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Proceedings of the 4th JSME-KSME Thermal Engineering Conference, pp.2 - 635-2-640 | - |
| dc.citation.title | Proceedings of the 4th JSME-KSME Thermal Engineering Conference | - |
| dc.citation.startPage | 2 | - |
| dc.citation.endPage | 635-2-640 | - |
| dc.citation.conferencePlace | JA | - |
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