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dc.contributor.author강경두-
dc.contributor.author박진성-
dc.contributor.author이채봉-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.author정귀상-
dc.date.accessioned2024-01-13T16:34:34Z-
dc.date.available2024-01-13T16:34:34Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109106-
dc.languageEnglish-
dc.subjectFEA-
dc.titleA study on pre-bonding mechanism of Si wafer at HF pre-treatment-
dc.title.alternativeHF 전처리시 실리콘 기판의 초기접합 메카니즘에 관한 연구-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation1999 년도 대한전기학회 하계학술대회 논문집, pp.3313 - 3315-
dc.citation.title1999 년도 대한전기학회 하계학술대회 논문집-
dc.citation.startPage3313-
dc.citation.endPage3315-
dc.citation.conferencePlaceKO-
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