Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Duck-Jung Lee | - |
dc.contributor.author | Ju Byeong Kwon | - |
dc.contributor.author | Nam-Yang Lee | - |
dc.contributor.author | Seong-Jae Jeong | - |
dc.contributor.author | Jin-Jang | - |
dc.contributor.author | OH MYUNG HWAN | - |
dc.date.accessioned | 2024-01-13T17:00:30Z | - |
dc.date.available | 2024-01-13T17:00:30Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/109122 | - |
dc.language | English | - |
dc.subject | FED | - |
dc.subject | FEA | - |
dc.subject | MEMS | - |
dc.title | Application of electrostatic bonding to FED packaging | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | IVMC '99, pp.44 - 45 | - |
dc.citation.title | IVMC '99 | - |
dc.citation.startPage | 44 | - |
dc.citation.endPage | 45 | - |
dc.citation.conferencePlace | GW | - |
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