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Application of electrostatic bonding to FED packaging

Authors

Duck-Jung Lee; Ju Byeong Kwon; Nam-Yang Lee; Seong-Jae Jeong; Jin-Jang; OH MYUNG HWAN

Citation

IVMC '99, pp.44 - 45

Keywords

FED; FEA; MEMS

URI

https://pubs.kist.re.kr/handle/201004/109122

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KIST Conference Paper > Others

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