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dc.contributor.author강경두-
dc.contributor.author박진성-
dc.contributor.author정수태-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.author정귀상-
dc.date.accessioned2024-01-13T17:03:00Z-
dc.date.available2024-01-13T17:03:00Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109274-
dc.languageEnglish-
dc.titleStudy on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding-
dc.title.alternative실리콘기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관한 연구-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국전기전자재료학회 '99 춘계학술대회 논문집, pp.370 - 373-
dc.citation.title한국전기전자재료학회 '99 춘계학술대회 논문집-
dc.citation.startPage370-
dc.citation.endPage373-
dc.citation.conferencePlaceKO-
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