Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ju Byeong Kwon | - |
| dc.contributor.author | 강경두 | - |
| dc.contributor.author | 박진성 | - |
| dc.contributor.author | 정수태 | - |
| dc.contributor.author | 정귀상 | - |
| dc.date.accessioned | 2024-01-13T17:32:19Z | - |
| dc.date.available | 2024-01-13T17:32:19Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.date.issued | 1999-11 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/109501 | - |
| dc.subject | wafer bonding | - |
| dc.title | HF 전처리시 Si 기판 직접접합의 초기접합 모델 | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 센서학회 종합학술대회, pp.327 - 330 | - |
| dc.citation.title | 센서학회 종합학술대회 | - |
| dc.citation.startPage | 327 | - |
| dc.citation.endPage | 330 | - |
| dc.citation.conferencePlace | KO | - |
- Appears in Collections:
- KIST Conference Paper > Others
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