DSpace at KIST: Flip chip bonder for automactic parallel aligning of IR sensors and read out integrated circuits

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DC Field	Value	Language
dc.contributor.author	SUH SANG HEE	-
dc.contributor.author	SONG JONG HYEONG	-
dc.contributor.author	AN SE YOUNG	-
dc.contributor.author	KIM JIN SANG	-
dc.date.accessioned	2024-01-13T17:32:54Z	-
dc.date.available	2024-01-13T17:32:54Z	-
dc.date.created	2021-09-29	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/109540	-
dc.language	English	-
dc.subject	자동 평행 배열	-
dc.title	Flip chip bonder for automactic parallel aligning of IR sensors and read out integrated circuits	-
dc.title.alternative	적외선 센서/ROIC 접합을 위한 자동 평행 배열 flip chip bonder	-
dc.type	Conference	-
dc.description.journalClass	2	-
dc.identifier.bibliographicCitation	제 10 회 적외선 영상 센서 Conference, pp.134 - 139	-
dc.citation.title	제 10 회 적외선 영상 센서 Conference	-
dc.citation.startPage	134	-
dc.citation.endPage	139	-
dc.citation.conferencePlace	KO	-

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