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dc.contributor.authorKim Yong Tae-
dc.contributor.author김동준-
dc.contributor.author이석형-
dc.contributor.authorPARK YOUNG KYUN-
dc.contributor.author김익수-
dc.contributor.author박종완-
dc.date.accessioned2024-01-13T18:03:30Z-
dc.date.available2024-01-13T18:03:30Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109837-
dc.languageEnglish-
dc.subjectPECVD-
dc.subjectSiOF-
dc.subjectW-N-
dc.subjectdiffusion barrier-
dc.titleEffects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationProc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies-
dc.citation.titleProc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies-
dc.citation.conferencePlaceUK-
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