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dc.contributor.authorVaibhav K. Andleigh-
dc.contributor.authorPARK YOUNG JOON-
dc.contributor.authorCarl V. Thompson-
dc.date.accessioned2024-01-13T18:30:31Z-
dc.date.available2024-01-13T18:30:31Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109924-
dc.languageEnglish-
dc.subjectelectromigration-
dc.subjectSimulation-
dc.subjectstress evolution-
dc.titleSimulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4, pp.1 - 4-
dc.citation.titleSRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4-
dc.citation.startPage1-
dc.citation.endPage4-
dc.citation.conferencePlaceUS-
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