Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Vaibhav K. Andleigh | - |
dc.contributor.author | PARK YOUNG JOON | - |
dc.contributor.author | Carl V. Thompson | - |
dc.date.accessioned | 2024-01-13T18:30:31Z | - |
dc.date.available | 2024-01-13T18:30:31Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/109924 | - |
dc.language | English | - |
dc.subject | electromigration | - |
dc.subject | Simulation | - |
dc.subject | stress evolution | - |
dc.title | Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4, pp.1 - 4 | - |
dc.citation.title | SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 4 | - |
dc.citation.conferencePlace | US | - |
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