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dc.contributor.author정지원-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.authorLEE YUN HI-
dc.contributor.authorN. Y. Lee-
dc.contributor.authorY. W. Ko-
dc.contributor.authorY. G. Moon-
dc.contributor.authorCHOI DOO JIN-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T18:31:57Z-
dc.date.available2024-01-13T18:31:57Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110015-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleTubeless packaging of field emission display using glass to glass electrostatic bonding technology-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationProc. IVMC '98, pp.42 - 43-
dc.citation.titleProc. IVMC '98-
dc.citation.startPage42-
dc.citation.endPage43-
dc.citation.conferencePlaceUS-
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