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dc.contributor.author이덕중-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorLEE YUN HI-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.authorLEE NAM YANG-
dc.contributor.author한정인-
dc.contributor.author조경익-
dc.contributor.author장진-
dc.date.accessioned2024-01-13T18:33:15Z-
dc.date.available2024-01-13T18:33:15Z-
dc.date.created2021-09-29-
dc.identifier.issn0098-0966-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110095-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleVacuum sealing of field-emission arrays using field-assisted bonding method-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationProc. SID '98, pp.589 - 592-
dc.citation.titleProc. SID '98-
dc.citation.startPage589-
dc.citation.endPage592-
dc.citation.conferencePlaceUS-
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