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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author최우범-
dc.contributor.author장진-
dc.contributor.authorLEE YUN HI-
dc.contributor.author이광배-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T20:02:41Z-
dc.date.available2024-01-13T20:02:41Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110852-
dc.languageEnglish-
dc.subjectsilicon direct bonding-
dc.subjectvacuum microelectronics-
dc.subjectwafer bonding-
dc.titleModified low-temperature direct bonding method for vacuum microelectronics application-
dc.title.alternative진공마이크로 일렉트로닉스 응용을 위한 수정된 저온 직접 접합법-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation대한전기학회 MEMS 연구회 학술발표회 논문집 , 고려대, pp.201 - 208-
dc.citation.title대한전기학회 MEMS 연구회 학술발표회 논문집 , 고려대-
dc.citation.startPage201-
dc.citation.endPage208-
dc.citation.conferencePlaceKO-
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