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Characteristics of amorphous Ta-Si-N thin film for Cu metallization

Other Titles

구리금속배선을 위한 비정질 Ta-Si-N 박막의 특성

Authors

김동준; 정순필; Kim Yong Tae; Min Suk-Ki; 박종완

Citation

제4회 한국 반도체 학술대회 (The 4th Korean conference on semiconductors) 논문집, pp.373 - 374

Keywords

Ta-Si-N; Cu metallization; amorphous; diffusion barrier

URI

https://pubs.kist.re.kr/handle/201004/110945

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KIST Conference Paper > Others

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