Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | KOH SEOK KEUN | - |
| dc.contributor.author | K. H. Kim | - |
| dc.contributor.author | S. C. Choi | - |
| dc.contributor.author | C. N. Whang | - |
| dc.contributor.author | 정형진 | - |
| dc.date.accessioned | 2024-01-13T20:04:22Z | - |
| dc.date.available | 2024-01-13T20:04:22Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/110956 | - |
| dc.language | English | - |
| dc.title | Enhancement of adhesion between Cu thin film and polyimide modified by ion assisted reaction | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Mat. res. soc. symp., pp.? | - |
| dc.citation.title | Mat. res. soc. symp. | - |
| dc.citation.startPage | ? | - |
| dc.citation.endPage | ? | - |
| dc.citation.conferencePlace | US | - |
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- KIST Conference Paper > Others
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