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Enhancement of adhesion between Cu thin film and polyimide modified by ion assisted reaction

Authors

KOH SEOK KEUN; K. H. Kim; S. C. Choi; C. N. Whang; 정형진

Citation

Mat. res. soc. symp., pp.?

URI

https://pubs.kist.re.kr/handle/201004/110956

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KIST Conference Paper > Others

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