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dc.contributor.authorHong Kyu Jang-
dc.contributor.authorCHOI WON-KOOK-
dc.contributor.authorKOH SEOK KEUN-
dc.contributor.authorK. H. Kim-
dc.contributor.authorD. J. Choi-
dc.contributor.authorS. Han-
dc.contributor.authorS. C. Choi-
dc.contributor.author정형진-
dc.date.accessioned2024-01-13T20:33:25Z-
dc.date.available2024-01-13T20:33:25Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111163-
dc.languageEnglish-
dc.subjectthermal stability-
dc.titleThermal stability of Cu films on TiN/Ti/Si(100) by partially ionized beam deposition-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMat. res. soc. symp. proc., v.438, pp.387 - ?-
dc.citation.titleMat. res. soc. symp. proc.-
dc.citation.volume438-
dc.citation.startPage387-
dc.citation.endPage?-
dc.citation.conferencePlaceUS-
dc.identifier.wosidA1997BH43C00057-
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