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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author최우범-
dc.contributor.author한정인-
dc.contributor.author조경인-
dc.contributor.author이광배-
dc.contributor.author장진-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T21:01:19Z-
dc.date.available2024-01-13T21:01:19Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111298-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleMulti-substrate bonding using anodic bonding method-
dc.title.alternative정전 열 접합을 이용한 multi-substrate bonding-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation센서기술학술대회 논문집 , 서울대, pp.221 - 226-
dc.citation.title센서기술학술대회 논문집 , 서울대-
dc.citation.startPage221-
dc.citation.endPage226-
dc.citation.conferencePlaceKO-
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