DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author정지원-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.author최우범-
dc.contributor.author정성재-
dc.contributor.authorLEE NAM YANG-
dc.contributor.authorCHOI DOO JIN-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T21:01:43Z-
dc.date.available2024-01-13T21:01:43Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111320-
dc.languageEnglish-
dc.subjectMEMS-
dc.subjectvacuum microelectronics-
dc.subjectwafer bonding-
dc.titleSilicon to silicon anodic bonding using lithium doped interlayer-
dc.title.alternative리튬이 도핑된 막을 이용한 실리콘 - 실리콘 접합-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation센서기술학술대회 논문집 , 서울대, pp.227 - 232-
dc.citation.title센서기술학술대회 논문집 , 서울대-
dc.citation.startPage227-
dc.citation.endPage232-
dc.citation.conferencePlaceKO-
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