DSpace at KIST: Effect of wet-etching process on the gate insulator of metal tip FEA

Full metadata record

DC Field	Value	Language
dc.contributor.author	정유호	-
dc.contributor.author	Ju Byeong Kwon	-
dc.contributor.author	Jung Jae Hoon	-
dc.contributor.author	LEE YUN HI	-
dc.contributor.author	OH MYUNG HWAN	-
dc.contributor.author	김철주	-
dc.date.accessioned	2024-01-13T21:01:52Z	-
dc.date.available	2024-01-13T21:01:52Z	-
dc.date.created	2021-09-29	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/111328	-
dc.language	English	-
dc.subject	FED	-
dc.subject	wafer bonding	-
dc.subject	tubeless packaging	-
dc.title	Effect of wet-etching process on the gate insulator of metal tip FEA	-
dc.title.alternative	금속팁 FEA에서 습식 식각 공정이 게이트 절연체에 미치는 영향	-
dc.type	Conference	-
dc.description.journalClass	2	-
dc.identifier.bibliographicCitation	제1회 한국정보디스플레이 학술대회 논문집, KIST, pp.137 - 138	-
dc.citation.title	제1회 한국정보디스플레이 학술대회 논문집, KIST	-
dc.citation.startPage	137	-
dc.citation.endPage	138	-
dc.citation.conferencePlace	KO	-

Show Simple Item Record

KIST Library Institutional Repository