DSpace at KISTKIST Conference PaperOthers

Full metadata record

DC Field Value Language
dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorLEE YUN HI-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T21:03:48Z-
dc.date.available2024-01-13T21:03:48Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111445-
dc.languageEnglish-
dc.subjectwafer bonding-
dc.subjectannealing-
dc.subjectelemental semiconductors-
dc.subjectetching-
dc.subjectinterface structure-
dc.subjectmaterials testing-
dc.subjectsemiconductor-insulator boundaries-
dc.subjectsilicon-
dc.subjectwafer bonding-
dc.titleStatus and new evaluation method of interfacial oxide between directly-bonded Si wafer pairs-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIEEE MEMS '96, San Diego, USA., pp.337 - 342-
dc.citation.titleIEEE MEMS '96, San Diego, USA.-
dc.citation.startPage337-
dc.citation.endPage342-
dc.citation.conferencePlaceUS-
Appears in Collections:
KIST Conference Paper > Others
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML
Show Simple Item Record

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE