DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorLEE YUN HI-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.authorH. W. Park-
dc.contributor.authorJ. H. Park-
dc.contributor.authorN. Y. Lee-
dc.contributor.authorK. H. Koh-
dc.contributor.authorD. K. Shin-
dc.contributor.authorI. B. Kang-
dc.contributor.authorN. Samaan-
dc.contributor.authorM. R. Haskard-
dc.date.accessioned2024-01-13T21:04:00Z-
dc.date.available2024-01-13T21:04:00Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111457-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleA low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMRS 1996 fall meeting, Boston, USA., pp.?-
dc.citation.titleMRS 1996 fall meeting, Boston, USA.-
dc.citation.startPage?-
dc.citation.endPage?-
dc.citation.conferencePlaceUS-
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