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A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer

Authors

Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard

Citation

MRS 1996 fall meeting, Boston, USA., pp.?

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/111457

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KIST Conference Paper > Others

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