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dc.contributor.authorHAN JUN HYUN-
dc.contributor.authorSHIN MYUNG CHUL-
dc.date.accessioned2024-01-13T21:04:34Z-
dc.date.available2024-01-13T21:04:34Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111491-
dc.subjectsemiconductor-
dc.subjectinterconnect-
dc.subjectrealiability-
dc.title.alternative반도체용 Interconnect (Al-2Cu) 에서 reliability향상에 대한 열처리의 영향-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국분석과학회 학술대회, pp.8-
dc.citation.title한국분석과학회 학술대회-
dc.citation.startPage8-
dc.citation.endPage8-
dc.citation.conferencePlaceKO-
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