Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | HAN JUN HYUN | - |
| dc.contributor.author | SHIN MYUNG CHUL | - |
| dc.date.accessioned | 2024-01-13T21:04:34Z | - |
| dc.date.available | 2024-01-13T21:04:34Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.date.issued | 1996-11 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/111491 | - |
| dc.subject | semiconductor | - |
| dc.subject | interconnect | - |
| dc.subject | realiability | - |
| dc.title | 반도체용 Interconnect (Al-2Cu) 에서 reliability향상에 대한 열처리의 영향 | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 한국분석과학회 학술대회, pp.8 | - |
| dc.citation.title | 한국분석과학회 학술대회 | - |
| dc.citation.startPage | 8 | - |
| dc.citation.endPage | 8 | - |
| dc.citation.conferencePlace | KO | - |
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