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dc.contributor.authorKum Dong Wha-
dc.contributor.authorH. C. Yoon-
dc.contributor.authorJ. J. lee-
dc.date.accessioned2024-01-13T23:31:23Z-
dc.date.available2024-01-13T23:31:23Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/112644-
dc.languageEnglish-
dc.titleEffect of residual stress on Si-condumptin during W-deposition by LPCVD.-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationAdvanced metallizations in microelectronics, MRS symposium proceedings, v.v. 201, pp.609 - 612-
dc.citation.titleAdvanced metallizations in microelectronics, MRS symposium proceedings-
dc.citation.volumev. 201-
dc.citation.startPage609-
dc.citation.endPage612-
dc.citation.conferencePlaceUS-
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