Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kum Dong Wha | - |
dc.contributor.author | H. C. Yoon | - |
dc.contributor.author | J. J. lee | - |
dc.date.accessioned | 2024-01-13T23:31:23Z | - |
dc.date.available | 2024-01-13T23:31:23Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/112644 | - |
dc.language | English | - |
dc.title | Effect of residual stress on Si-condumptin during W-deposition by LPCVD. | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | Advanced metallizations in microelectronics, MRS symposium proceedings, v.v. 201, pp.609 - 612 | - |
dc.citation.title | Advanced metallizations in microelectronics, MRS symposium proceedings | - |
dc.citation.volume | v. 201 | - |
dc.citation.startPage | 609 | - |
dc.citation.endPage | 612 | - |
dc.citation.conferencePlace | US | - |
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