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Effect of residual stress on Si-condumptin during W-deposition by LPCVD.

Authors

Kum Dong Wha; H. C. Yoon; J. J. lee

Citation

Advanced metallizations in microelectronics, MRS symposium proceedings, v.v. 201, pp.609 - 612

URI

https://pubs.kist.re.kr/handle/201004/112644

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KIST Conference Paper > Others

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